Die Attach Operator
Job Description:
1. Responsible for the daily operation, loading and unloading, program calling, and basic parameter setting of the die bonding machine.2. Use a microscope to inspect the appearance of wafers and brackets to ensure the quality of incoming materials.
3. Complete basic operational processes such as dispensing, wafer picking, and die bonding independently, and ensure production efficiency and pass rate.
4. Perform routine maintenance and cleaning on the equipment as required, and fill out the checklist.
5. Responsible for self-inspection and mutual inspection of products during the production process, identifying and reporting production anomalies (such as missing crystals, misaligned crystals, missing solidification, etc.).
6. Complete the recording and statistics of production data, ensuring the accuracy and completeness of the records.
7. Maintain 6S management in the work area and ensure compliance with cleanliness requirements.
Job requirements:
1. College degree or above, with major in electronics, machinery, mechatronics or related fields preferred.2. Candidates with over half a year of experience in operating die bonding machines are preferred. For those without experience, training can be provided, but they must have experience in manufacturing assembly lines.
3. Able to work under a microscope for extended periods and possess good hand-eye coordination.
4. Work carefully and responsibly, and strictly adhere to operating procedures and quality standards.
5. Possess basic comprehension skills and be able to understand operation manuals and simple drawings.